Package carrier and manufacturing method thereof

ABSTRACT

A package carrier includes a substrate, at least one heat conducting element, an insulating material, a first patterned circuit layer and a second patterned circuit layer. The substrate has an upper surface, a lower surface and a through hole. The heat conducting element is disposed inside the through hole and has a first surface and a second surface. The insulating material has a top surface, a bottom surface and at least one cavity extending from the top surface to the heat conducting element. The heat conducting element is fixed in the through hole by the insulating material, and the cavity exposes a portion of the first surface of the heat conducting element. The first patterned circuit layer is disposed on the upper surface and the top surface, and the second patterned circuit layer is disposed on the lower surface and the bottom surface.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the priority benefit of Taiwan applicationserial no. 104130526, filed on Sep. 16, 2015. The entirety of theabove-mentioned patent application is hereby incorporated by referenceherein and made a part of this specification.

BACKGROUND OF THE INVENTION

Field of the Invention

The present invention relates to a carrier structure and a method formanufacturing the same, and particularly relates to a package carrierand a method for manufacturing the same.

Description of Related Art

In general, the package carrier is mainly constructed by multiplepatterned conductive layers and at least one insulation layer, whereinthe insulation layer is disposed between two adjacent patternedconductive layers to achieve the insulation effect. In order to enhancethe heat dissipation effect, a heat dissipation block is usually fixedto the lower surface of the package carrier via an adhesive layer, suchthat the heat generated by the electronic elements on the packagecarrier can transfer through the patterned conductive layer and theinsulation layer to the heat dissipation block so as to perform thermalconductivity. Because the adhesive layer and the insulation layergenerally have a poor thermal conductivity, the thermal resistance isincreased when the heat generated by the electronic elements transfersthrough the insulation layer and the adhesive layer to the heatdissipation block, so as to result in poor heat dissipation. Inaddition, using the heat dissipation block fixed to the package carrieralso increase the thickness of the package carrier so that the light andthin requirements for current products are unable to be fulfilled.

SUMMARY OF THE INVENTION

The invention provides a package carrier, which is adapted to carry atleast one heat generating element.

The invention also provides a manufacturing method of the packagecarrier, which is adapted to manufacture the above-mentioned packagecarrier.

The package carrier of the invention includes a substrate, at least oneheat conducting element, an insulating material, a first patternedcircuit layer, and a second patterned circuit layer. The substrate hasan upper surface and a lower surface opposite to each other, and athrough hole connecting the upper surface and the lower surface. Theheat conducting element is disposed inside the through hole and has afirst surface and a second surface opposite to each other. The thicknessof the heat conducting element is smaller than the thickness of thesubstrate. The insulating material is located between the heatconducting element and the inner wall of the through hole, and the heatconducting element is fixed in the through hole by the insulatingmaterial. The insulating material has a top surface and a bottom surfaceopposite to each other. The top surface of the insulating material andthe upper surface of the substrate are approximately coplanar. Thebottom surface of the insulating material, the lower surface of thesubstrate, and the second surface of the heat conducting element areapproximately coplanar. The insulating material and the heat conductingelement define at least one cavity extending from the top surface of theinsulating material to the heat conducting element, and the cavityexposes a portion of the first surface of the heat conducting element.The first patterned circuit layer is disposed on the upper surface ofthe substrate and the top surface of the insulating material, andexposes portions of the substrate and the top surface. The secondpatterned circuit layer is disposed on the lower surface of thesubstrate and the bottom surface of the insulating material, and exposesportions of the substrate and the bottom surface.

In one embodiment of the invention, materials of the heat conductingelement include ceramic, silicon, silicon carbide, diamond, metal, or alamination layer formed by a combination thereof.

In one embodiment of the invention, the heat conducting element includesa first metal layer, a second metal layer, and a heat conductingmaterial layer. The heat conducting material layer is disposed betweenthe first metal layer and the second metal layer, and the first metallayer and the second metal layer have the first surface and the secondsurface respectively.

In one embodiment of the invention, the package carrier further includesa first solder mask layer and a second solder mask layer. The firstsolder mask layer is at least disposed on a portion of the firstpatterned circuit layer and the substrate exposed by the first patternedcircuit layer. The second solder mask layer is at least disposed on thesubstrate exposed by the second patterned circuit layer.

In one embodiment of the invention, the package carrier further includesa first surface treatment layer and a second surface treatment layer.The first surface treatment layer is at least disposed on the firstpatterned circuit layer. The second surface treatment layer is disposedon the second patterned circuit layer.

In one embodiment of the invention, the first patterned circuit layer isfurther disposed on the inner wall of the cavity and the first surfaceof the heat conducting element exposed by the cavity.

In one embodiment of the invention, the first surface treatment layer isfurther disposed on the first surface of the heat conducting elementexposed by the cavity.

In one embodiment of the invention, the at least one heat conductingelement includes a first heat conducting element and a second heatconducting element. The at least one cavity includes a first cavity anda second cavity. The first cavity exposes a portion of the first heatconducting element and the second cavity exposes a portion of the secondheat conducting element. The thickness of the first heat conductingelement is smaller than the thickness of the second heat conductingelement, and the depth of the first cavity is greater than the depth ofthe second cavity.

The invention provides the manufacturing method of the package carrier,which includes following steps. Providing a substrate, wherein thesubstrate has an upper surface and a lower surface opposite to eachother, and a through hole connecting the upper surface and the lowersurface. Disposing at least one heat conducting element inside thethrough hole of the substrate, wherein the thickness of the heatconducting element is smaller than the thickness of the substrate. Theheat conducting element is fixed in the through hole by an insulatingmaterial, and the insulating material is located between the heatconducting element and the inner wall of the through hole. Theinsulating material has a top surface and a bottom surface opposite toeach other, the heat conducting element has a first surface and a secondsurface opposite to each other, the top surface of the insulatingmaterial and the upper surface of the substrate are approximatelycoplanar, and the bottom surface of the insulating material, the lowersurface of the substrate, and the second surface of the heat conductingelement are approximately coplanar. Forming a first patterned circuitlayer and a second patterned circuit layer. The first patterned circuitlayer is at least formed on the upper surface of the substrate and thetop surface of the insulating material and exposes portions of thesubstrate and the top surface. The second patterned circuit layer isformed on the lower surface of the substrate and the bottom surface ofthe insulating material and exposes portions of the substrate and thebottom surface. Forming at least one cavity extending from the topsurface of the insulating material to the heat conducting element,wherein the cavity exposes a portion of the first surface of the heatconducting element.

In one embodiment of the invention, steps for disposing the heatconducting element inside the through hole of the substrate comprise:providing an adhesive layer on the lower surface of the substrate,wherein the adhesive layer and the through hole of the substrate definean accommodating space; disposing the heat conducting element on theadhesive layer and inside the accommodating space; filling theaccommodating space with the insulating material to encapsulate the heatconducting element and to fix the heat conducting element in the throughhole; and removing the adhesive layer to expose the lower surface of thesubstrate and the bottom surface of the insulating material.

In one embodiment of the invention, steps for forming the firstpatterned circuit layer and the second patterned circuit layer comprise:forming a first circuit layer and a second circuit layer, wherein thefirst circuit layer is formed on the upper surface of the substrate andthe top surface of the insulating material, and the second circuit layeris formed on the lower surface of the substrate and the bottom surfaceof the insulating material; and patterning the first circuit layer andthe second circuit layer to form the first patterned circuit layer andthe second patterned circuit layer.

In one embodiment of the invention, steps after forming the cavityextending from the top surface of the insulating material to the heatconducting element further comprise: forming a first solder mask layer,wherein the first solder mask layer is at least disposed on a portion ofthe first patterned circuit layer and the substrate exposed by the firstpatterned circuit layer; and forming a second solder mask layer, whereinthe second solder mask layer is at least disposed on the substrateexposed by the second patterned circuit layer.

In one embodiment of the invention, steps after forming the cavityextending from the top surface of the insulating material to the heatconducting element further comprise: forming a first surface treatmentlayer, wherein the first surface treatment layer is at least disposed onthe first patterned circuit layer; and forming a second surfacetreatment layer, wherein the second surface treatment layer is disposedon the second patterned circuit layer.

In one embodiment of the invention, the first patterned circuit layer isfurther disposed on the inner wall of the cavity and the first surfaceof the heat conducting element exposed by the cavity.

In one embodiment of the invention, the first surface treatment layer isfurther disposed on the first surface of the heat conducting elementexposed by the cavity.

In one embodiment of the invention, materials of the heat conductingelement include ceramic, silicon, silicon carbide, diamond, metal, or alamination layer formed by a combination thereof.

In one embodiment of the invention, the heat conducting element includesa first metal layer, a second metal layer, and a heat conductingmaterial layer. The heat conducting material layer is disposed betweenthe first metal layer and the second metal layer, and the first metallayer and the second metal layer have the first surface and the secondsurface respectively.

In one embodiment of the invention, the at least one heat conductingelement includes a first heat conducting element and a second heatconducting element. The at least one cavity includes a first cavity anda second cavity. The first cavity exposes a portion of the first heatconducting element and the second cavity exposes a portion of the secondheat conducting element. The thickness of the first heat conductingelement is smaller than the thickness of the second heat conductingelement, and the depth of the first cavity is greater than the depth ofthe second cavity.

Based on the above, the heat conducting element of the package carrierof the invention is fixed in the through hole of the substrate by theinsulating material, and the cavity of the insulating material exposes aportion of the first surface of the heat conducting element. Therefore,subsequently, when the package carrier carries a heat generatingelement, the heat generating element can be disposed in the cavity ofthe insulating material, can directly contact the heat conductingelement, and can electrically connect with the first surface treatmentlayer by the wire. As a result, in the package carrier of the invention,except that the heat generated by the heat conducting element caneffectively transfer to the external environment, the wiring path isalso shortened effectively, so as to reduce the thickness of the packagestructure.

In order to make the aforementioned and other features and advantages ofthe invention more comprehensible, embodiments accompanying figures aredescribed in detail belows.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention.

FIG. 1A to FIG. 1G are cross-sectional schematic views depicting amanufacturing method of a package carrier of one embodiment of theinvention.

FIG. 2 is a cross-sectional schematic view depicting a package carrierof one embodiment of the invention.

FIG. 3 is a cross-sectional schematic view depicting a package carrierof one embodiment of the invention.

FIG. 4 is a cross-sectional schematic view depicting the package carrierin FIG. 1G carrying a heat generating element.

FIG. 5 is a cross-sectional schematic view depicting the package carrierin FIG. 2 carrying a heat generating element.

FIG. 6 depicts a package carrier carrying two heat generating elementsaccording to one embodiment of the invention.

DESCRIPTION OF THE EMBODIMENTS

FIG. 1A to FIG. 1G are cross-sectional schematic views depicting amanufacturing method of a package carrier of one embodiment of theinvention. According to the manufacturing method of the package carrierin the present embodiment, firstly, referring to FIG. 1A, providing asubstrate 110, wherein the substrate 110 has an upper surface 111 and alower surface 113 opposite to each other. The substrate 110 of thepresent embodiment can be, for example, a single layer circuit board, adouble layer circuit board, or a multi-layer circuit board. Herein, asshown in FIG. 1A, the substrate 110 is a double layer circuit boardwhich is constructed by a dielectric layer 112 and circuit layers 114,116 located at two opposite sides of the dielectric layer 112, but theinvention is not limited thereto.

Subsequently, referring to FIG. 1B, a through hole H connecting theupper surface 111 and the lower surface 113 is formed in the substrate110 by punching, routing, mechanical drilling, laser drilling, or otherappropriate methods.

Subsequently, referring to FIG. 1C, providing an adhesive layer 115 onthe lower surface 113 of the substrate 110, wherein the adhesive layer115 and the through hole H of the substrate 110 define an accommodatingspace S. It should be noted here, the adhesive layer 115 is only adheredto the lower surface 113 of the substrate 110 temporarily to serve as asupporting element for a subsequent heat conducting element 120.Subsequently, the heat conducting element 120 is disposed on theadhesive layer 115 and located inside the accommodating space S, whereinthe thickness of the heat conducting element 120 is smaller than thethickness of the substrate 110, the thickness of the heat conductingelement 120 is, for example, from one tenth to nine-tenths of thethickness of the substrate 110, and will not be limited thereto. Theheat conducting element 120 has a first surface 122 and a second surface124 opposite to each other, and the second surface 124 directly contactsthe adhesive layer 115. Herein, materials of the heat conducting element120 include ceramic, silicon, silicon carbide, diamond, metal, or alamination layer formed by a combination thereof.

Subsequently, referring to FIG. 1C, an insulating material 130 fills theaccommodating space S so as to encapsulate the heat conducting element120 and to fix the heat conducting element 120 in the through hole H ofthe substrate 110, wherein the insulating material 130 has a top surface132 and a bottom surface 134 opposite to each other. At this time, asshown in FIG. 1C, the heat conducting element 120 is fixed in thethrough hole H of the substrate 110 by the insulating material 130, andthe insulating material 130 is located between the heat conductingelement 120 and the inner wall of the through hole H. In other words,the insulating material 130 is used to fix the relative position betweenthe heat conducting element 120 and the substrate 110.

Subsequently, referring to FIG. 1C and FIG. 1D simultaneously, removingthe adhesive layer 115 to expose the lower surface 113 of the substrate110 and the bottom surface 134 of the insulating material 130. At thistime, the top surface 132 of the insulating material 130 and the uppersurface 111 of the substrate 110 are approximately coplanar, and thebottom surface 134 of the insulating material 130, the lower surface 113of the substrate 110, and the second surface 124 of the heat conductingelement 120 are approximately coplanar, it means a package carrier 100 awhich is subsequently formed (referring to FIG. 1G) can have a bettersurface flatness. At this point, steps for disposing the heat conductingelement 120 inside the through hole H of the substrate 110 arecompleted.

Subsequently, referring to FIG. 1D, forming a first circuit layer 140′and a second circuit layer 150′, wherein the first circuit layer 140′ isformed on the upper surface 111 of the substrate 110 and the top surface132 of the insulating material 130, and the second circuit layer 150′ isformed on the lower surface 113 of the substrate 110 and the bottomsurface 134 of the insulating material 130. Herein, the method to formthe first circuit layer 140′ and the second circuit layer 150′ is, forexample, electroplating method.

Next, referring to FIG. 1E, patterning the first circuit layer 140′ andthe second circuit layer 150′, so as to form a first patterned circuitlayer 140 and a second patterned circuit layer 150. At this time, thefirst patterned circuit layer 140 is formed on the upper surface 111 ofthe substrate 110 and the top surface 132 of the insulating material130, and exposes a portion of the dielectric layer 112 of the substrate110 and a portion of the top surface 132 of the insulating material 130.The second patterned circuit layer 150 is formed on the lower surface113 of the substrate 110 and the bottom surface 134 of the insulatingmaterial 130, and exposes a portion of the dielectric layer 112 of thesubstrate 110 and a portion of the bottom surface 134 of the insulatingmaterial 130.

After that, referring to FIG. 1F, the first patterned circuit layer 140serving as a mask, forming at least one cavity C extending from the topsurface 132 of the insulating material 130 to the heat conductingelement 120, wherein the cavity C exposes a portion of the first surface122 of the heat conducting element 120. Herein, the first patternedcircuit layer 140 can serve as the mask to form the cavity C by laserablation or routing method. In addition, after forming the cavity C,optionally forming a first solder mask layer 160 and a second soldermask layer 170, wherein the first solder mask layer 160 is at leastdisposed on a portion of the first patterned circuit layer 140 and thedielectric layer 112, which is exposed by the first patterned circuitlayer 140, of the substrate 110, and the second solder mask layer 170 isat least disposed on the dielectric layer 112, which is exposed by thesecond patterned circuit layer 150, of the substrate 110.

Finally, referring to FIG. 1G, in order to maintain the structuralproperties of the exposed first patterned circuit layer 140 and theexposed second patterned circuit layer 150, forming a first surfacetreatment layer 180 and a second surface treatment layer 190, whereinthe first surface treatment layer 180 is at least disposed on the firstpatterned circuit layer 140 exposed by the first solder mask layer 160,and the second surface treatment layer 190 is disposed on the secondpatterned circuit layer 150. Herein, the first surface treatment layer180 is further disposed on the first surface 122, which is exposed bythe cavity C, of the heat conducting element 120. The material of thefirst surface treatment layer 180 and the second surface treatment layer190 in the present embodiment is, for example, nickel, palladium, gold,or alloys of the said materials, so as to prevent the first patternedcircuit layer 140 and the second patterned circuit layer 150 from beingoxidized or being subject to the external contamination. So far, thepackage carrier 100 a is completely manufactured.

In above structure, referring to FIG. 1G, the package carrier 100 a ofthe present embodiment includes the substrate 110, the heat conductingelement 120, the insulating material 130, the first patterned circuitlayer 140, and the second patterned circuit layer 150. The substrate 110has the upper surface 111 and the lower surface 113 opposite to eachother, and the through hole H connecting the upper surface 111 and thelower surface 113. The heat conducting element 120 is disposed insidethe through hole H and has a first surface 122 and a second surface 124opposite to each other. The thickness of the heat conducting element 120is smaller than the thickness of the substrate 110. The insulatingmaterial 130 is located between the heat conducting element 120 and theinner wall of the through hole H, and the heat conducting element 120 isfixed in the through hole H by the insulating material 130. Theinsulating material 130 has the top surface 132 and the bottom surface134 opposite to each other. The top surface 132 of the insulatingmaterial 130 and the upper surface 111 of the substrate 110 areapproximately coplanar. The bottom surface 134 of the insulatingmaterial 130, the lower surface 113 of the substrate 110, and the secondsurface 124 of the heat conducting element 120 are approximatelycoplanar. The insulating material 130 and the heat conducting element120 define at least one cavity C extending from the top surface 132 ofthe insulating material 130 to the heat conducting element 120, and thecavity C exposes a portion of the first surface 122 of the heatconducting element 120. The first patterned circuit layer 140 isdisposed on the upper surface 111 of the substrate 110 and the topsurface 132 of the insulating material 130, and exposes a portion of thedielectric layer 112 of the substrate 110 and a portion of the topsurface 132 of the insulating material 130. The second patterned circuitlayer 150 is disposed on the lower surface 113 of the substrate 110 andthe bottom surface 134 of the insulating material 130, and exposes aportion of the dielectric layer 112 of the substrate 110 and a portionof the bottom surface 134 of the insulating material 130.

In addition, the package carrier 100 a of the present embodiment furtherincludes the first solder mask layer 160 and the second solder masklayer 170, wherein the first solder mask layer 160 is at least disposedon a portion of the first patterned circuit layer 140 and the dielectriclayer 112, which is exposed by the first patterned circuit layer 140, ofthe substrate 110, and the second solder mask layer 170 is at leastdisposed on the dielectric layer 112, which is exposed by the secondpatterned circuit layer 150, of the substrate 110. Otherwise, in orderto maintain the structural properties of the exposed first patternedcircuit layer 140 and the exposed second patterned circuit layer 150,the package carrier 100 a of the present embodiment further includes thefirst surface treatment layer 180 and the second surface treatment layer190, wherein the first surface treatment layer 180 is disposed on thefirst patterned circuit layer 140 exposed by the first solder mask layer160, and the second surface treatment layer 190 is disposed on thesecond patterned circuit layer 150.

The heat conducting element 120 of the package carrier 100 a of thepresent embodiment is fixed in the through hole H of the substrate 110by the insulating material 130, and the cavity C of the insulatingmaterial 130 exposes a portion of the first surface 122 of the heatconducting element 120. Therefore, referring to FIG. 4, subsequently,when the package carrier 100 a carries the heat generating element 210,the heat generating element 210 can be disposed in the cavity C of theinsulating material 130, can directly contact the first surfacetreatment layer 180 located on the first surface 122 of the heatconducting element 120, and can electrically connect with the firstsurface treatment layer 180 located on the first patterned circuit layer140 by a plurality of wires 220. In addition, the heat generatingelement 210, the wire 220, and the first solder mask layer 160 and thefirst surface treatment layer 180 of the package carrier 100 a areencapsulated by a molding compound 230 so as to form a package structure10. As a result, in the package carrier 100 a of the present embodiment,except that the heat generated by the heat conducting element 210 caneffectively and rapidly transfer sequentially through the first surfacetreatment layer 180, the heat conducting element 120, the secondpatterned circuit layer 150, and the second surface treatment layer 190to the external environment, the wiring path of the wire 220 is alsoshortened effectively because of the configurational position of theheat conducting element 210, so as to effectively reduce the thicknessof the package structure 10 that is formed.

It should be noted here, the present embodiment is not limited to theforming sequence of the cavity C of the insulating material 130, thefirst patterned circuit layer 140, and the second patterned circuitlayer 150. In the above-mentioned embodiment, although the cavity C ofthe insulating material 130 is formed after the first patterned circuitlayer 140 and the second patterned circuit layer 150, in anotherembodiment, referring to FIG. 2, the cavity C of the insulating material130 of the package carrier 100 b can also be formed before the firstpatterned circuit layer 140 a and the second patterned circuit layer 150a, and therefore the first patterned circuit layer 140 a is furtherdisposed on the inner wall of the cavity C and the first surface 122 ofthe heat conducting element 120 exposed by the cavity C. In addition,the first surface treatment layer 180 a that is subsequently formed canfurther disposed on the first patterned circuit layer 140 a on the firstsurface 122 of the heat conducting element 120 exposed by the cavity C.In other words, at least the first patterned circuit layer 140 a and thefirst surface treatment layer 180 a located on the first patternedcircuit layer 140 a are disposed on the cavity C of the insulatingmaterial 130.

Referring to FIG. 5, subsequently, when the package carrier 100 bcarries the heat generating element 210, the heat generating element 210can be disposed in the cavity C of the insulating material 130, candirectly contact the first surface treatment layer 180 a, and canelectrically connect with the first surface treatment layer 180 alocated on the first patterned circuit layer 140 a by the wire 220. Inaddition, the heat generating element 210, the wire 220, and the firstsolder mask layer 160 and the first surface treatment layer 180 a of thepackage carrier 100 b are encapsulated by the molding compound 230 so asto form a package structure 20. As a result, in the package carrier 100b of the present embodiment, except that the heat generated by the heatconducting element 210 can effectively and rapidly transfer sequentiallythrough the first surface treatment layer 180 a, the first patternedcircuit layer 140 a, the heat conducting element 120, the secondpatterned circuit layer 150, and the second surface treatment layer 190to the external environment, the wiring path of the wire 220 is alsoshortened effectively because of the configurational position of theheat conducting element 210, so as to effectively reduce the thicknessof the package structure 20 that is formed.

In addition, the present embodiment is also not limited to the structuretype of the heat conducting element 120. In above-mentioned embodiment,although the heat conducting element 120 is embodied as a blockstructure having arc-shaped corners so as to increase the adhesion forcebetween the heat conducting element 120 and the insulating material 130,but in another embodiment, referring to FIG. 3, the heat conductingelement 120 a of the package carrier 100 c in the present embodiment canalso be formed by a first metal layer 121, a second metal layer 123, anda heat conducting material layer 125, wherein the heat conductingmaterial layer 125 is disposed between the first metal layer 121 and thesecond metal layer 123, and the first metal layer 121 and the secondmetal layer 123 have the first surface 122 and the second surface 124respectively. Herein, materials of the heat conducting material layer125 include ceramic, silicon, silicon carbide, diamond, etc., theceramic material is, for example, alumina, aluminum nitride, etc., butthe invention is not be limited thereto.

In addition, it should be noted here, the invention is not limited tothe quantity of cavity C of the insulating material 130, and to thequantity of each of the heat conducting elements 120, 120 a disposed inthe package carriers 100 a, 100 b, 100 c. In above-mentioned embodiment,the quantity of the cavity C of the insulating material 130 is one, andthe quantity of each of the heat conducting elements 120, 120 a disposedin the package carriers 100 a, 100 b, 100 c is also one. However, inother embodiments, referring to FIG. 6, the package carrier 100 d of thepresent embodiment has two heat conducting elements, namely a first heatconducting element 120 b and a second heat conducting element 120 c, andthe insulating material 130′ has a first cavity C1 and a second cavityC2. The first cavity C1 exposes a portion of the first heat conductingelement 120 b and the second cavity C2 exposes a portion of the secondheat conducting element 120 c. The thickness T1 of the first heatconducting element 120 b is smaller than the thickness T2 of the secondheat conducting element 120 c, and the depth D1 of the first cavity C1is greater than the depth D2 of the second cavity C2. Because theinsulating material 130′ of the present embodiment has the first cavityC1 and the second cavity C2, the package carrier 100 d is adapted tocarry two heat generating elements 210 a, 210 b.

Referring to FIG. 6, subsequently, when the package carrier 100 dcarries the heat generating elements 210 a, 210 b, the heat generatingelements 210 a, 210 b can be respectively disposed in the first cavityC1 and the second cavity C2 of the insulating material 130′, candirectly contact the first surface treatment layer 180, and canelectrically connect with the first surface treatment layer 180 locatedon the first patterned circuit layer 140 on the upper surface 111 of thesubstrate 110 by the wire 220. In addition, the heat generating elements210 a, 210 b, the wire 220, and the first solder mask layer 160 and thefirst surface treatment layer 180 of the package carrier 100 d areencapsulated by the molding compound 230 so as to form a packagestructure 30. As a result, in the package carrier 100 d of the presentembodiment, except that the heat generated by the heat conductingelements 210 a, 210 b can effectively and rapidly transfer through thefirst surface treatment layer 180, the first heat conducting element 120b, the second heat conducting element 120 b, the second patternedcircuit layer 150, and the second surface treatment layer 190 to theexternal environment, the wiring path of the wire 220 is also shortenedeffectively because of the configurational position of the heatconducting elements 210 a, 210 b, so as to simultaneously reduce thewiring cost and to effectively reduce the thickness of the packagestructure 30 that is formed.

In summary, the heat conducting element of the package carrier of theinvention is fixed in the through hole of the substrate by theinsulating material, and the cavity of the insulating material exposes aportion of the first surface of the heat conducting element. Therefore,subsequently, when the package carrier carries a heat generatingelement, the heat generating element can be disposed in the cavity ofthe insulating material, can directly contact the heat conductingelement, and can electrically connect with the first surface treatmentlayer by the wire. As a result, in the package carrier of the invention,except that the heat generated by the heat conducting element caneffectively transfer to the external environment, the wiring path isalso shortened effectively, so as to reduce cost and to reduce thethickness of the package structure.

Although the present invention has been described with reference to theabove embodiments, it will be apparent to one of the ordinary skill inthe art that modifications to the described embodiments may be madewithout departing from the spirit of the invention. Accordingly, thescope of the invention is defined by the attached claims not by theabove detailed descriptions.

What is claimed is:
 1. A manufacturing method of a package carrier,adapted to carry at least one heat generating element, and themanufacturing method of the package carrier, comprising: providing asubstrate, wherein the substrate has an upper surface and a lowersurface opposite to each other, and a through hole connecting the uppersurface and the lower surface; disposing at least one heat conductingelement inside the through hole of the substrate, wherein a thickness ofthe heat conducting element is smaller than a thickness of thesubstrate, the heat conducting element is fixed in the through hole byan insulating material and the insulating material is located betweenthe heat conducting element and an inner wall of the through hole,wherein the insulating material has a top surface and a bottom surfaceopposite to each other, the heat conducting element has a first surfaceand a second surface opposite to each other, the top surface of theinsulating material and the upper surface of the substrate areapproximately coplanar, and the bottom surface of the insulatingmaterial, the lower surface of the substrate, and the second surface ofthe heat conducting element are approximately coplanar; forming a firstpatterned circuit layer and a second patterned circuit layer, whereinthe first patterned circuit layer is at least formed on the uppersurface of the substrate and the top surface of the insulating materialand exposes portions of the substrate and the top surface, and thesecond patterned circuit layer is formed on the lower surface of thesubstrate and the bottom surface of the insulating material, and exposesportions of the substrate and the bottom surface; and forming at leastone cavity having a depth and extending from the top surface of theinsulating material to the heat conducting element, wherein the cavityexposes a portion of the first surface of the heat conducting element,and the first surface of the heat conducting element is lower than thetop surface of the insulating material.
 2. The manufacturing method ofthe package carrier as recited in claim 1, wherein steps for disposingthe heat conducting element inside the through hole of the substratecomprise: providing an adhesive layer on the lower surface of thesubstrate, wherein the adhesive layer and the through hole of thesubstrate define an accommodating space; disposing the heat conductingelement on the adhesive layer and inside the accommodating space;filling the accommodating space with the insulating material toencapsulate the heat conducting element and to fix the heat conductingelement in the through hole; and removing the adhesive layer to exposethe lower surface of the substrate and the bottom surface of theinsulating material.
 3. The manufacturing method of the package carrieras recited in claim 1, wherein steps for forming the first patternedcircuit layer and the second patterned circuit layer comprise: forming afirst circuit layer and a second circuit layer, wherein the firstcircuit layer is formed on the upper surface of the substrate and thetop surface of the insulating material, and the second circuit layer isformed on the lower surface of the substrate and the bottom surface ofthe insulating material; and patterning the first circuit layer and thesecond circuit layer to form the first patterned circuit layer and thesecond patterned circuit layer.
 4. The manufacturing method of thepackage carrier as recited in claim 1, wherein steps after forming thecavity extending from the top surface of the insulating material to theheat conducting element further comprise: forming a first solder masklayer, wherein the first solder mask layer is at least disposed on aportion of the first patterned circuit layer and the substrate exposedby the first patterned circuit layer; and forming a second solder masklayer, wherein the second solder mask layer is at least disposed on thesubstrate exposed by the second patterned circuit layer.
 5. Themanufacturing method of the package carrier as recited in claim 1,wherein steps after forming the cavity extending from the top surface ofthe insulating material to the heat conducting element further comprise:forming a first surface treatment layer, wherein the first surfacetreatment layer is at least disposed on the first patterned circuitlayer; and forming a second surface treatment layer, wherein the secondsurface treatment layer is disposed on the second patterned circuitlayer.
 6. The manufacturing method of the package carrier as recited inclaim 5, wherein the first patterned circuit layer is further disposedon an inner wall of the cavity and the first surface of the heatconducting element exposed by the cavity.
 7. The manufacturing method ofthe package carrier as recited in claim 5, wherein the first surfacetreatment layer is further disposed on the first surface of the heatconducting element exposed by the cavity.
 8. The manufacturing method ofthe package carrier as recited in claim 1, wherein materials of the heatconducting element comprise ceramic, silicon, silicon carbide, diamond,metal, or a lamination layer formed by a combination thereof.
 9. Themanufacturing method of the package carrier as recited in claim 1,wherein the heat conducting element comprises a first metal layer, asecond metal layer, and a heat conducting material layer, the heatconducting material layer is disposed between the first metal layer andthe second metal layer, and the first metal layer and the second metallayer have the first surface and the second surface respectively. 10.The manufacturing method of the package carrier as recited in claim 1,wherein the at least one heat conducting element comprises a first heatconducting element and a second heat conducting element, the at leastone cavity comprises a first cavity and a second cavity, the firstcavity exposes a portion of the first heat conducting element, thesecond cavity exposes a portion of the second heat conducting element,and a thickness of the first heat conducting element is smaller than athickness of the second heat conducting element and a depth of the firstcavity is greater than a depth of the second cavity.
 11. A manufacturingmethod of a package structure, comprising: providing a substrate,wherein the substrate has an upper surface and a lower surface oppositeto each other, and a through hole connecting the upper surface and thelower surface; disposing at least one heat conducting element inside thethrough hole of the substrate, wherein a thickness of the heatconducting element is smaller than a thickness of the substrate, theheat conducting element is fixed in the through hole by an insulatingmaterial and the insulating material is located between the heatconducting element and an inner wall of the through hole, wherein theinsulating material has a top surface and a bottom surface opposite toeach other, the heat conducting element has a first surface and a secondsurface opposite to each other, the top surface of the insulatingmaterial and the upper surface of the substrate are approximatelycoplanar, and the bottom surface of the insulating material, the lowersurface of the substrate, and the second surface of the heat conductingelement are approximately coplanar; forming a first patterned circuitlayer and a second patterned circuit layer, wherein the first patternedcircuit layer is at least formed on the upper surface of the substrateand the top surface of the insulating material and exposes portions ofthe substrate and the top surface, and the second patterned circuitlayer is formed on the lower surface of the substrate and the bottomsurface of the insulating material, and exposes portions of thesubstrate and the bottom surface; forming at least one cavity having adepth and extending from the top surface of the insulating material tothe heat conducting element, wherein the cavity exposes a portion of thefirst surface of the heat conducting element, and the first surface ofthe heat conducting element is lower than the top surface of theinsulating material; and depositing at least one heat generating elementin the cavity and on the first surface of the heat conducting element.12. A manufacturing method of a package carrier, comprising: providing asubstrate, wherein the substrate has an upper surface and a lowersurface opposite to each other, and at least one through hole connectingthe upper surface and the lower surface; disposing at least a first heatconducting element and a second heat conducting element inside the atleast one through hole of the substrate, wherein a thickness of thefirst heat conducting element and the second heat conducting elementrespectively is smaller than a thickness of the substrate, each of thefirst heat conducting element and the second heat conducting element isrespectively fixed in the at least one through hole by an insulatingmaterial and the insulating material is at least located between thefirst heat conducting element and an inner wall of the through hole andbetween the second heat conducting element and the inner wall of thethrough hole, wherein the insulating material has a top surface and abottom surface opposite to each other, the first heat conducting elementand the second heat conducting element respectively has a first surfaceand a second surface opposite to each other, the top surface of theinsulating material and the upper surface of the substrate areapproximately coplanar, and the bottom surface of the insulatingmaterial, the lower surface of the substrate, and the second surface ofthe first heat conducting element and the second heat conducting elementare approximately coplanar; forming a first patterned circuit layer anda second patterned circuit layer, wherein the first patterned circuitlayer is at least formed on the upper surface of the substrate and thetop surface of the insulating material and exposes portions of thesubstrate and the top surface, and the second patterned circuit layer isformed on the lower surface of the substrate and the bottom surface ofthe insulating material, and exposes portions of the substrate and thebottom surface; and forming at least a first cavity and a second cavityrespectively extending from the top surface of the insulating materialto the first heat conducting element and the second heat conductingelement, wherein the first cavity exposes a portion of the first heatconducting element, the second cavity exposes a portion of the secondheat conducting element, and a thickness of the first heat conductingelement is smaller than a thickness of the second heat conductingelement and a depth of the first cavity is greater than a depth of thesecond cavity.